Elektrische Eigenschaften
Features
·Designed for circuit prototyping with ICs and discrete components
·Accurate silk-screening & positional markings
·Double sided board
Specifications
·Board thickness: 1.58mm
·Hole diameter: 1.07mm
·Hole spacing: 2.54mm
·Plating: Plated through hole
·Circuit pattern: Pad per hole
Materials
·FR-4 epoxy glass
·Solder plated, 2-ounce copper
·Edge contacts: Gold plated
·Durable conformal coating