Features

·The open frame is most common type
·The open body design gives better access (for cleaning and inspections) to air-cooling
·Side and end stackable
·High retention design prevents IC walkout during heavy vibration
·Closed bottom sleeve for 100% anti-wicking of silder
·Twist free construction

Specifications

·Pitch: 2.54mm
·No. of contacts: 20
·Pin type: Machined
·Current rating: 3A Max.
·Orientation: Straight
·Termination: Solder
·Mounting type: Through hole
·Contact resistance: 4mΩ Max.
·Insulation resistance: 10000MΩ Min. at 500VDC
·Rated voltage: 100V RMS / 150VDC
·Operating temperature: Gold plated: -55°C to +125°C；Tin plated: -40°C to +105°C
·Insertion force with steel pin: 250g Max.
·Withdrawal force with steel pin: 50g Min.
·Mechanical life: 200 Min.
Environmental data
·Solderability: 235°C, 2s
·Resistance to soldering heart-through hole mount components: 260°C, 10s

Materials

·Pin (outer sleeve): Brass, machined, CuZn38Pb2
·Clip (contact 4 finger): Beryllium copper, heat treated or PHBZ
·Plating (outer sleeve):
Tin plated: 2um/80u" nickel, 5um/200u" tin
Gold plated: 2um/80u" nickel, full gold
·Plating clip (contact): 2um/80u" tin plating
·Insulator body (black): Glass filled thermoplastic polyester UL94V-0